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Intel Details PowerVia Chipmaking Tech: Backside Power Performing Well, On Schedule For 2024

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At next week’s annual VLSI Symposium, Intel will be presenting a trio of highly-anticipated papers about their progress with their upcoming PowerVia chip fabrication technology – the company’s in-development implementation of backside power delivery networks. Along with Intel’s RibbonFET technology… Read More »Intel Details PowerVia Chipmaking Tech: Backside Power Performing Well, On Schedule For 2024