TSMC is no stranger to building big chips. Besides the ~800mm2 reticle limit of their normal logic processes, the company already produces even larger chips by fitting multiple dies on to a single silicon interposer, using their chip-on-wafer-on-substrate (CoWoS) technology.… Read More »TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today’s

Across the internet, from online forums such as Reddit to various other tech media outlets, there’s a lot of furor around reports of Intel’s top-end 14th and 13th Gen K series of processors running into stability issues. As Intel’s flagship… Read More »In Light of Stability Concerns, Intel Issues Request to Motherboards Vendors to Actually Follow Stock Power Settings

While the all-in-one CPU cooler industry is dominated, at least in mindshare, by flagship coolers from the industry’s biggest brands, the market segment overall has grown over the years to cover a much larger gamut of users. From flagship coolers… Read More »The AlphaCool Core Ocean T38 360mm AIO CPU Cooler Review: Loud and Proud

Optical connectivity – and especially silicon photonics – is expected to become a crucial technology to enable connectivity for next-generation datacenters, particularly those designed HPC applications. With ever-increasing bandwidth requirements needed to keep up with (and keep scaling out) system performance, copper… Read More »TSMC Jumps Into Silicon Photonics, Lays Out Roadmap For 12.8 Tbps COUPE On-Package Interconnect

TSMC has been offering its System-on-Wafer integration technology, InFO-SoW, since 2020. For now, only Cerebras and Tesla have developed wafer scale processor designs using it, as while they have fantastic performance and power efficiency, wafer-scale processors are extremely complex to… Read More »TSMC’s System-on-Wafer Platform Goes 3D: CoW-SoW Stacks Up the Chips

While the bulk of attention on TSMC is aimed at its leading-edge nodes, such as N3E and N2, loads of chips will continue to be made using more mature and proven process technologies for years to come. Which is why… Read More »TSMC Preps Cheaper 4nm N4C Process For 2025, Aiming For 8.5% Cost Reduction

Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC’s 2 nm plans remain largely unchanged: the company is on track to start volume production of… Read More »TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells

With the arrival of spring comes showers, flowers, and in the technology industry, TSMC’s annual technology symposium series. With customers spread all around the world, the Taiwanese pure play foundry has adopted an interesting strategy for updating its customers on… Read More »TSMC’s 1.6nm Technology Announced for Late 2026: A16 with “Super Power Rail” Backside Power

Seagate Technology has reportedly notified its customers abouts its plans to raise prices on new hard drive orders and for demands that exceed prior agreements, echoing a similar move by Western Digital, which increased its prices earlier this month. These… Read More »Report: Seagate, Western Digital Hike HDD Prices Amid Surge In Demand

As Qualcomm prepares for the mid-year launch of their forthcoming Snapdragon X SoCs for PCs, and the eagerly anticipated Oryon CPU cores within, the company is finally shoring up their official product plans, and releasing some additional technical details in… Read More »Qualcomm Intros Snapdragon X Plus, Details Complete Snapdragon X Launch Day Chip Stack